乐泰3838t胶水 苹果手机主板芯片保护bga胶，销售热线：189-258/5-3678，联系人：姚天星。product deion loctite eccobond en 3838t provides the following product characteristics: technology epoxy appearance black liquid product benefits ● one component ● thixotropic ● fast cure at moderate temperatures ● low tg ● low modulus ● reworkable ● pb-free applications cure heat cure application encapsulant typical package application csp and bga loctite eccobond en 3838t is designed to provide an flexible, low tg material for encapsulating components on a pcb. when cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.
联 系 人：姚先生
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