模块配件图片：

Product Specification

Issue 1 (2009-01-20) Commercial in Confidence Page 7 of 70
1 Overview
1.1 Introduction
HUAWEI EM560 TD-HSDPA PC Embedded Module (hereinafter referred to as the
EM560) is a TD-HSDPAWirelessWide Area Network (WWAN) PC module. It is a
multi-mode wireless terminal for business professionals.
The EM560 supports the following standards:
l Time Division-High Speed Download Packet Access(TD-HSDPA)
l Time Division-Synchronous Code Division Multiple Access (TD-SCDMA)
l Enhanced Data Rates for Global Evolution (EDGE)
l General Packet Radio Service (GPRS)
l Global System for Mobile Communications (GSM)
The EM560 provides the following services:
l TD-HSDPA packet data service
l EDGE/GPRS packet data service
l TD-SCDMA/GSM short message service (SMS)
The EM560 can be connected to a PC via the Mini PCI Express interface. In the
service area of the TD-HSDPA, TD-SCDMA, EDGE, GPRS or GSM network, you can
surf the Internet, send messages and emails, and receive messages/emails
cordlessly. The EM560 is fast, reliable, and easy to operate. Thus, mobile users can
experience many new features and services with the EM560. These features and
services will enable a large number of users to use the EM560 and the average
revenue per user (ARPU) of operators will increase substantially.
Figure 1-1 shows the profile of the EM560.
Figure 1-1 Profile of the EM560
批注 [l001454131]: 需要硬
件修改图片
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Product Specification
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1.2 Key Features
Table 1-1 lists the key features of the EM560.
Table 1-1 Key features of the EM560
Feature EM560
TD-HSDPA/TD-SCDMA 2010－2025 MHz Y
TD-HSDPA/TD-SCDMA 1880－1920 MHz Y
TD-HSDPA/TD-SCDMA 2300－2400 MHz N
GSM/GPRS/EDGE 900/1800 MHz Y
TD-HSDPA data service of up to 2.8 Mbit/s Y
TD-SCDMA PS domain data service of up to 384 kbps Y
EDGE packet data service of up to 236.8 kbps Y
GPRS packet data service of up to 85.6 kbps Y
CS domain data service based on TD-SCDMA and GSM Y
SMS based on the CS/PS domain of GSM and TD-SCDMA Y
Unstructured Supplementary Service Data (USSD) N
PCM interface Y
Mini PCI Express 1.2 interface Y
Windows 2000/Windows XP/Windows Vista later versions Y
Notes:
Y: Support the feature.
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O: The feature is optional.
N: Do not support the feature.
1.3 Hardware Overview
The hardware of the EM560 consists of three sections: baseband section, power
management (PM) section, and radio frequency (RF) section. External interfaces
include the antenna interface and the Mini PCI Express interface.
1.3.1 Hardware Logic Block Diagram
The EM560 is completed on a single-board. Figure 1-2 shows the hardware
functional block diagram.
Figure 1-2 Hardware functional block diagram
Baseband
Mini PCI-E
DC/DC DC/DC
Power Management
MCP
(1GNAND Flash+512
SDRAM)
TD Modem TDD LCR
GSM PA
GSM
Transceiver
RF Switch
3.3V 5V
3.7V
USIM Card
The circuitry of the EM560 consists of three sections: baseband section, RF section,
and PM section.
l The baseband section includes the baseband processor and SDRAM/flash MCP.
It implements baseband signals processing, wireless protocols, and
management of various peripheral devices.
l The RF section includes the RF transceiver, PA, antenna switches, and antenna
interfaces,.
l The PMU section includes PM IC and DC-DC circuits, providing the power
supply and power management for the whole module.
l The WIFI section is optional.
1.3.2 External Hardware Interfaces
1. Antenna interface
The EM560 has one antenna connector for TD-SCDMA and GSM.
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TD-SCDMA/GSM antenna connector (labeled with M on the PCB)
2. Mini PCI Express interface
The interface of the EM560 is a standard Mini PCI Express interface. The EM560
consists of several major signals, as shown in the following figure.
Figure 1-3 Mini PCI Express identification
PC
Mini PCI-E
USB
USIM
PERST#
W_Disable_N
LED_WWAN
POWER
GROUND
PCM(Optional)
− USIM interface: The USIM interface provides the interface for a USIM card.
The USIM card can be inserted into the PC.
− USB interface: The USB interface supports two modes of USB 2.0 (low speed,
full speed). Because there is not a separate USB-controlled voltage bus, USB
functions implemented on EM560 which are expected to report as selfpowered
devices.
− PCM interface (Optional): The PCM interface provides interface for external
codecs.
− Auxiliary signals: The auxiliary signals provide some other functions.
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− Power sources and grounds: The PCI Express Mini Card provides two power
sources, including the one at 3.3 Vaux (3.3Vaux) and the one at 1.5 V(+1.5 V).
The EM560 uses the 3.3 voltage as the power supply.
1.4 Software Overview
Figure 1-4 Software logic block diagram
Descriptions of the functional modules in the system architecture are as follows.
Firmware Drivers
The firmware drivers include drivers of the RF module, flash, and all the peripherals
such as the SIM card and USB device.
Platform Service Subsystem
The platform service subsystem initializes programs, diagnoses, downloads data,
and serves as a watchdog.
Dashboard
PC Drivers
Application Service
Subsystem
Firmware Drivers
Platform Service Subsystem
PC
Firmware
Mini PCIE interface
Firmware
PC Drivers
Dashboard
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Application Service Subsystem
The application service subsystem consists of various application services and a TDSCDMA-
GSM dual mode protocol stack. Application services handle the commands
and data sent from PC side according to service categories, and deliver them to
the protocol stack. The protocol stack communicates with the network side to process
the commands and data, and returns response from network to application services.
Finally, application services return responses to PC side.
The main application services are as follows:
l Call management service
l SMS service
l CS/PS data service
PC Drivers
The PC drivers are used to implement functions such as the interaction between the
dashboard and the firmware.
Dashboard
The dashboard enables the PC side to display the interfaces of initiating or
answering a call, and sending and receiving messages. It provides the interface for
CS/PS domain network accessing and periodically refreshes the interface of the
current USB modem status. The interface is provided to the end users.
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2 Mechanical Specifications
2.1 Dimensions and interfaces
2.1.1 Dimensions and interfaces of the EM560
The dimensions of the EM560 are 51 mm (length) × 30 mm (width) × 5 mm (height),
which comply with the standard dimensions specified in the PCI Express Mini Card
Electromechanical Specification Revision 1.2. Figure 2-1 shows the dimensions of
the EM560 in details.
Figure 2-1 Dimensions of the EM560
Figure 2-2 shows the appearance of the interfaces on the EM560.
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Figure 2-2 Appearance of the interfaces on the EM560
Mini PCI Express connector
It is used to connect the EM560 to the WWAN Mini PCI Express interface of the PC.
Screw holes
They are used to fix the EM560 on the main board of the PC with screws.
Antenna interfaces
They are used to connect to antennas,one for TD-HSDPA /TD-SCDMA and GSM, the
other two for WIFI(optional).
2.1.2 Dimensions of theMini PCI Express Connector
The EM560 adopts a standard Mini PCI Express connector that has 52 pins and
complies with the PCI Express Mini Card Electromechanical Specification Revision
1.2.
Figure 2-3 shows a 52-pin Mini PCI Express connector (take the Molex 67910002 as
an example).
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Figure 2-3 Dimensions of the Mini PCI Express connector
2.1.3 Dimensions of the Antenna Connector
The EM560 provides an interface for connecting an external antenna. The external
antenna is connected to the module through the coaxial connector that is the Hirose
U.FL-R-SMT-1(10) (you can get to know Hirose U.FL-R-SMT-1(10) by visiting the
websitehttp://www.hirose-connectors.com/products/U.FL_1.htm).
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Figure 2-4 Dimensions of the antenna connector
Figure 2-5 shows the specifications of the antenna mating connectors (take the ones
with the Hirose part number as U.FL-LP as examples).
Figure 2-5 Specifications of the antenna mating connectors
For more information about Hirose Ltd., SMD connectors, and mating connectors,
visit the website of Hirosehttp://www.hirose-connectors.com.
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2.2 Reliability
Table 2-1 Requirements on the environment reliability
Test Case Standard
High temperature IEC60068-2-2
High temperature IEC60068-2-1
Random vibration
MIL-STD-810F
-METHOD 514.5
Shock vibration ANSI/TIA-603-C-2004 -3.3.5
Operational
Sine sweep vibration ANSI/TIA-603-C-2004 -3.3.4
High temperature IEC60068-2-2
Low temperature IEC60068-2-1
Damp heat, cyclic IEC60068-2-30
Thermal shock IEC60068-2-14
Salt-fog IEC60068-2-11
Drop IEC 60068-2-32
Environment
reliability
Nonoperational
Durability EIA-364-9
2.3 Temperature
Table 2-2 Operating and storage temperature
Description Minimum Maximum Unit
Operating temperature –10 +55 ℃
Storage temperature –40 +85 ℃
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3 Electrical Specifications
3.1 Mini PCI Express Pin Definition
The physical connections and signal levels of the EM560 comply with PCI Express
Mini CEM specifications. Device operations comply with USB 2.0 specifications.
Table 3-1 lists the Mini PCI Express connector pins out of the EM560.
Table 3-1 Definition of mini PCI Express pins
Definition of the EM560Mini PCI Express pins
Pin
No.
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Additional
Description
Direction to
Module
1 WAKE# NC Not connected. –
2 3.3Vaux VCC_3V3 3.3 V DC supply
rails from the PC
side.
Input
3 COEX1 BT_ACTIVE③ Indicates medium
busy from an
external souce.
Input
4 GND GND Mini Card ground. –
5 COEX2 RX_CLEAR③ Indicates medium
clear to an
external device
Output
6 1.5 V NC Not connected. –
7 CLKREQ# WIFI_CLKREQ_N③ Reference clock
request signal
Output
8 UIM_PWR VDD_USIM Power source for
the external
UIM/SIM card.
Output
9 GND GND Mini Card ground. –
10 UIM_DATA SIMIOCD_N External UIM/SIM
data signal.
Input/Output
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Definition of the EM560Mini PCI Express pins
Pin
No.
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Additional
Description
Direction to
Module
11 REFCLK- WIFI_REFCLK-③ PCI Express
reference clock
Input
12 UIM_CLK SIMCLKCD_N External UIM/SIM
clock signal.
Output
13 REFCLK+ WIFI_REFCLK+③ PCI Express
reference clock
Input
14 UIM_RESET SIMRSTCD External UIM/SIM
reset signal.
Output
15 GND GND Mini Card ground. –
16 UIM_Vpp NC Not connected. –
17 Reserved PCIE_WLAN_DISAB
LE/UART_RX①
For close wireless
communications
Input
18 GND GND Mini Card ground. –
19 Reserved PCIE_WIFI_PERST_
N/UART_TX②
Force a hardware
reset on the card
Input
20 W_DISABLE# PCIE_W_DISABLE_
N
/PCIE_WLAN_DISAB
LE①
For ending the
wireless
communications
Input
21 GND GND Mini Card ground. –
22 PERST# PCIE_3G_PERST_N
/
PCIE_WIFI_PERST_
N②
For forcing a
hardware reset on
the card.
Input
23 PERn0 WIFI_PERN0③ PCI Express x1
data interface: one
differential transmit
pair and one
differential receive
pair
Input/Output
24 3.3Vaux NC Not connected. –
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Definition of the EM560Mini PCI Express pins
Pin
No.
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Additional
Description
Direction to
Module
25 PERp0 WIFI_PERP0③ PCI Express x1
data interface: one
differential transmit
pair and one
differential receive
pair
Input/Output
26 GND GND Mini Card ground. –
27 GND GND Mini Card ground. –
28 1.5 V NC Not connected. –
29 GND GND Mini Card ground. –
30 SMB_CLK SCL③ SMBus clock
signal compliant to
the SMBus 2.0
specification
Input
31 PETn0 WIFI_PETNO③ PCI Express x1
data interface: one
differential transmit
pair and one
differential receive
pair
Input/Output
32 SMB_DATA SDA③ SMBus data signal
compliant to
the SMBus 2.0
specification
Input/Output
33 PETp0 WIFI_PETP0③ PCI Express x1
data interface: one
differential transmit
pair and one
differential receive
pair
Input/Output
34 GND GND Mini Card ground. –
35 GND GND Mini Card ground. –
36 USB_D- USB_D- USB signal D-. Input/Output
37 GND GND GND –
38 USB_D+ USB_D+ USB signal D+. Input/Output
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Definition of the EM560Mini PCI Express pins
Pin
No.
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Additional
Description
Direction to
Module
39 3.3Vaux VCC_3V3 3.3V DC supply
rail from the PC
side.
Input
40 CPUSB# GND GND –
41 3.3Vaux VCC_3V3 3.3V DC supply
rail from the PC
side.
Input
42 LED_WWAN# LED_WWAN Active-low LED
signal for
indicating the state
of the card.
Output
43 GND GND GND –
44 LED_WLAN# LED_WLAN③ Active-low LED
signal for
indicating the state
of the card of WIFI
Output
45 Reserved IOM_ADCL③ PCM clock Output
46 LED_WPAN# NC Not connected. –
47 Reserved IOM_ADD③ PCM data output Output
48 1.5 V NC Not connected –
49 Reserved IOM_ADU③ PCM_data input Input
50 GND GND Mini Card Ground –
51 Reserved IOM_AFSC③ PCM frame
synchronization
Output
52 3.3Vaux VCC_3V3 3.3V DC supply
rail from the PC
side.
Input
Defaoult Pin20 used for PCIE_W_DISABLE_N and Pin17 NC
Optional Pin17 used for PCIE_W_DISABLE_N and
PCIE_WLAN_DISABLE ,and Pin20 NC
Optional Pin20 used for PCIE_W_DISABLE_N and
PCIE_WLAN_DISABLE ,and Pin17 used for UART_RX
①
Optional Pin20 used for PCIE_W_DISABLE_N with Pin17 used for
PCIE_WLAN_DISABLE
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Definition of the EM560Mini PCI Express pins
Pin
No.
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
Additional
Description
Direction to
Module
Defaoult Pin22 used for PCIE_3G_PERST_N and Pin 19 NC
Optional Pin22 used for PCIE_3G_PERST_N and Pin 19 used for
PCIE_WIFI_PERST_N
Optional Pin19 used for PCIE_3G_PERST_N and
PCIE_WIFI_PERST_N ,and Pin22 NC
②
Optional Pin22 used for PCIE_3G_PERST_N and
PCIE_WIFI_PERST_N ,and Pin 19 used for UART_TX
③
I2C & PCM &WIFI function is optional, default NOT
support , these pins will be CONNECT when these
functions are needed
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3.2 Pin Descriptions
3.2.1 Digital Signal DC Characteristics
Table 3-2 Digital signal DC characteristics
Symbol Description Minimum Maximum Unit Notes
VIH High-level input voltage,
CMOS/Schmitt
0.7•VDD_X VDD_X +
0.3
V 1
VIL Low-level input voltage,
CMOS/Schmitt
–0.3 0.3• VDD_X V 1
VOH High-level output voltage,
CMOS
VDD_X- 0.5 VDD_X V 1
VOL Low-level output voltage,
CMOS
0 0.4 V 1
IIH Input high leakage current – 1 μA 1
IIL Input low leakage current –1 – μA 1
IIHPD Input high leakage current
with pull-down
10 60 μA 1
IILPU Input low leakage current
with pull-up
–60 –10 μA 1
IOZH High-level, three-state
leakage current
– 1 μA 1
IOZL Low-level, three-state
leakage current
–1 – μA 1
IOZHPD High-level, three-state
leakage current with pulldown
10 60 μA 1
IOZLPU Low-level, three-state
leakage current with pullup
–60 –10 μA 1
CIN Input capacitance – 7 pF 1, 2
Notes:
1. Table 3-2 lists the universal specifications of the signals. Any difference from the universal
specifications is listed in the related chapter or section.
2. The input capacitance value is guaranteed by design and not completely tested.
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3.2.2 Power Sources and Grounds
The PCI Express Mini Card provides two power sources: one is 3.3Vaux (3.3 Vaux)
and the other is 1.5V (+ 1.5 V). For the EM560, +3.3Vaux is the only supply voltage
available. The input voltage is 3.3 V ± 9%, as specified by PCI Express Mini CEM
Specifications 1.2.
Table 3-3 Power and ground specifications
Name Pins Minimum Type Maximum
VCC 2, 39, 41, and 52 3.0 V 3.3 V 3.6 V
GND 4, 9, 15, 18, 21, 26, 27, 34, 35,
37, 43, and 50
0 V
3.2.3 USB Signals
The EM560 is compliant with USB 2.0 specification. It supports full-speed and highspeed
when acting as a peripheral and supports low-speed, full-speed, and highspeed
when acting as a host. The USB 2.0 specifications allow peripherals to support
any one or more of these speeds.
Table 3-4 USB pins
Name Pin Description Direction to Module
USB D- 36 USB data signal D- Input/Output
USB D+ 38 USB data signal D+ Input/Output
The USB interface is powered directly from the 3.3 V supply. The USB input/output
lines are compatible with the USB 2.0 3.3 V signal specifications.
Table 3-5 USB signal DC characteristics
VOHmin VOLmax VIHmin VILmax
2.8V 0.3V 2V 0.8V
3.2.4 USIM Signals
The USIM is a smart card for TD-SCDMA/GSM cellular applications. The USIM
provides the required subscription information to allow the mobile equipment to
attach to a GSM or TD-SCDMA network. The USIM also provides the subscriber\'s
verification procedures as well as authentication methods for network authentication
during the attach procedures.
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Table 3-6 USIM pins
Pin Name Description Direction to
Module
8 UIM_PWR Power source for the external
UIM/SIM.
Output
10 UIM_DATA External UIM/SIM data signal. Input/Output
12 UIM_CLK External UIM/SIM clock signal. Output
14 UIM_RESET External UIM/SIM reset signal. Output
16 UIM_Vpp Programming power connection used
to program EEPROM of first
generation ICCs, but not used now.
Not connected
Notes:
It is recommended that the SIM card is inserted only after the power of the module is
disconnected, otherwise the SIM card can be destroyed.
USIM interface schematic reference:
There is no SIM card interface circuit in the EM560 module, and users need to add
the USIM interface circuit. The definition of interface signals and the typical USIM
interface schematic are as follows.
Figure 3-1 USIM interface schematic on user’s PC
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Design guide
The USIM signals are connected to the Mini PCI Express card connector (the card
edge connector) and pass through an EMI filtering and ESD protection circuit on the
module board before entering the EM560 processor. There is also an EMI filtering
and ESD protection circuit between SIM card interface and Mini PCI interface on the
user’s board.
1. Power supply
The SIM interface is powered by an LDO regulator. The default value of this regulator
is 2.85 V. The power of the regulator is programmable in the range of 1.5 V to 3.05 V
and is expected to be set to 3.0 V or 1.8 V.
2. Modem signals
After a power-on or reset, the USIM signals are activated to detect if a SIM card is
present and to initialize it if it exists. Once a card has been detected and initialized,
the interface is always on. However, the clock signal is only activated when data is
actually being transferred. The USIM signals from the MSM are connected to the
level translators and then to the Mini Card host connector.
These levels exceed those required in ISO/IEC 7816-3.
3. SIM signals
The following data is taken from ETSI standard Specification of the 3 Volt Subscriber
Identity Module - Mobile Equipment (SIM-ME) interface (GSM 11.12 version 4.3.1).
Table 3-7 SIM RST requirements
RST Minimum Maximum
VIL 0 0.2Vcc
VIH 0.7Vcc Vcc
Table 3-8 SIM CLK requirements
CLK Minimum Maximum
VIL 0 0.2Vcc
VIH 0.7Vcc Vcc
Table 3-9 SIM IO requirements
IO Minimum Maximum
VIL 0 0.4
VIH 0.7Vcc Vcc
VOL –0.3 0.2Vcc
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IO Minimum Maximum
VOH 0.7Vcc Vcc+0.3
The IO signal is bidirectional and is pulled up to VCC by a 20 kΩ resistor, as the
standard recommends.
Notes:
This pull-up resistor should be placed near to the SIM connector and it should be connected to
the UIM PWR.
The VOLmax of 0.45 V for the outputs is specified at an output current of 3 mA whereas the
VILmax of 0.4 V for the SIM IO input is specified at an input current of 1 mA. With the smaller
current drive, the output voltage would be driven lower than the stated maximum value.
4. ESD protection
Since the SIM is a CMOS device, ESD protection devices should be placed near to
the SIM connector to provide protection. In addition, all the SIM interface signals
should be bypassed with a 33 pF capacitor.
5. Clock frequency
The SIM must support clock frequencies between 1 MHz and 4 MHz. (The Mini Card
can be programmed to generate a clock of 1.625 MHz, 2.6 MHz, or 3.25 MHz).
6. Routing recommendations
The SIM interface signals consist of four signals that are Vcc, RST, CLK, and IO (Vpp
is also connected but not used in many applications). Due to the relatively low clock
frequencies involved, the concern is not the degradation of the SIM signals
themselves. The main concern is routing of the SIM interface signals through areas
considered to be of high risk for RF noise coupling (crosstalk and RF contamination)
which can desensitize the radio circuitry. The general guidelines that should be
followed are listed as follows:
l It is recommended that these signals should be routed over a contiguous ground
plane.
l SIM interface signals should not be routed near high transient signals (power
supply chokes and DC/DC switching FETs).
l Avoid routing of these signals near output connectors.
l Keep SIM interface signals isolated from other signals. 2x width spacing (1.5x
min) between SIM interface signals and all other signal routing is recommended.
3.2.5W_DISABLE# Signal
The W_DISABLE# signal is provided to allow users to disable wireless
communications add-in cards. When the W_DISABLE# signal is asserted, all radios
should be disabled. When the W_DISABLE# signal is not asserted, the radio may
transmit if not disabled by other means such as software.
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The W_DISABLE# signal is an active low signal with internal 100 kΩ pull-up resistor
that shall disable radio operation when being asserted (driven low) by the system.
Due to the potential of a software disable state, the combination of the software state
and W_DISABLE# assertion state must be determined before the normal operation is
resumed. Table 3-11 lists this requirement on the function of W_DISABLE# and the
software control setting. For example, the radio RF operation remains disabled
unless both the hardware and software are set to enable the RF features of the card.
Table 3-10 W_DISABLE_N signal
Pins Name Description Direction to Module
20 W_DISABLE_N Close wireless communications Input
Table 3-11 Radio operational states
W_DISABLE# SW Control Setting* Radio Operation
High Enabled Enabled
High Disabled
Low Enabled
Low Disabled
Disabled
* This control setting is implementation specific; this column represents the collective
intention of the host software to manage radio operation.
If PC uses a hardware switch or EC(Embedded Controller) control W_DISABLE#,
3.3V VCC Main Voltage and W_DISABLE# must meet Figure 3-2 power sequences.
Figure 3-2 power sequences timing diagram
Notes:
We strongly recommend controlling this pin via hot-keys or a hardware switch. There are three
points as bellow:
1. If we don’t turn off radio manually, radio will be on when module is powered on.
2. End users need turn off radio at some situation like on an airplane.
3. According to Mini-PCIE specification, we must turn off radio through hardware or software.
Nearly all PC companies obey this specification.
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3.2.6 LED_WWAN# Signal
The LED_WWAN signal of the EM560 can tolerate up to the voltage of 5 V and
absorb the current up to150 mA. According to the given circuit, in order to reduce the
current of the LED, a resistance of 1 kΩ must be placed in series with the LED.
Table 3-12 LED_WWAN signal
Pins Name Description Additional
Description
Direction to
Module
42 LED_WWAN Active-low LED signal
for indicating the status
of the module.
L: Light on
H: Light off
Output
This signal is used to display the state of WWAN. The reference circuit diagram is
shown in the following figure.
Figure 3-3 LED_WWAN# signal reference circuit diagram
Notes:
The wink mode of the LED can be customized by the demand of the client.
3.2.7 PERST# Signal
The PERST# signal has an internal pull-up. The active low input is used to hard reset
the module.
The PERST# signal is de-asserted by the host to indicate that system power sources
are within the specified voltage tolerance and are stable. PERST# can be asserted
by the host when power is switched off and also can be used by the system to force a
hardware reset on the card. However, a hardware reset is not required during normal
operation and may only be used in case of module malfunction.
100 n
1 kΩ LED
Module
VCC
LED_WWAN signal
1 kΩ
PC
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A hard reset of the module will result in a surprise removal of the module on the USB
controller and cause the operating system to unload the device drivers. This will lead
to a delay before the operating system discovers the device again. To avoid this delay,
the PERST# pin should not be used in normal operation or in standby mode.
Table 3-13 PERST# signal
Pins Name Description Additional
Description
Direction to
Module
22 PERST# Force a hardware reset
on the card.
H: normal or
standby.
L: Reset the
module.
Input
3.2.8 NC Pins
The NC pins are not internally connected in the EM560.
3.3 Power Supply and Consumption
3.3.1 Power Supply
The EM560 is supplied by 3.3 V power source, which must satisfy all requirements of
PCI Express Mini CEM specifications, such as voltage tolerance and peak and
normal current. The detailed requirements are listed in Table 3-14.
Table 3-14 Power requirements
Power Voltage Tolerance Peak (Maximum) Normal (Maximum)
3.3 V ±9% 2750 mA 1100 mA
Notes:
1. In burst transmit mode of GSM/GPRS/EDGE, the peak current of the module will exceed 2 A,
which will pull down the power voltage transitorily and perhaps result in the reset of the module
or host. In order to avoid this case, you can add a large bulk capacitor beside the module on the
host side.
2. To minimize the RF radiation through the PCI-E interface, you can add a 33 pF ceramic
capacitor to ground on every pin of the PCI-E on the host side except USB D+/D-.
3.3.2 Power Consumption
The power consumptions of the EM560 in different scenarios are respectively listed
in Table 3-15, Table 3-16 and Table 3-17.
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Table 3-15 DC power consumption (TD-HSDPA/TD-SCDMA)
Description Band Test Value Units Power (dBm)
1 dBm Tx Power
Band I (IMT2100) 10 dBm Tx Power
mA
24 dBm Tx Power
1 dBm Tx Power
10 dBm Tx Power
TD-SCDMA
Band II
(PCS 1900)
mA
24 dBm Tx Power
1 dBm Tx Power
Band I (IMT2100) 10 dBm Tx Power
mA
24 dBm Tx Power
1 dBm Tx Power
10 dBm Tx Power
TD-HSDPA
Band II
(PCS 1900)
mA
24 dBm Tx Power
Table 3-16 DC power consumption (GSM/GPRS/EDGE)
Description Test Value Units PCL Configuration
1 Up/1 Down
mA 5 2 Up/1 Down
4 Up/1 Down
1 Up/1 Down
2 Up/1 Down
GPRS900
mA 11
4 Up/1 Down
1 Up/1 Down
mA 0 2 Up/1 Down
4 Up/1 Down
1 Up/1 Down
2 Up/1 Down
GPRS1800
mA 11
4 Up/1 Down
1 Up/1 Down
2 Up/1 Down
EDGE900
mA 8
4 Up/1 Down
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Description Test Value Units PCL Configuration
1 Up/1 Down
mA 15 2 Up/1 Down
4 Up/1 Down
1 Up/1 Down
mA 2 2 Up/1 Down
4 Up/1 Down
1 Up/1 Down
2 Up/1 Down
EDGE1800
mA 10
4 Up/1 Down
Table 3-17 DC power consumption(Idle and Suspend)
Scenario Idle1 Suspend
Offline
Enabled
Offline
Disabled
Offline
Enabled
Offline
Disabled
Unit
TD-HSDPA
TD-SCDMA
2100MHz
DRX = 8 (2.56 s)
mA
GSM 1800MHz
MFRM = 5 (1.18 s)
mA
GSM 900MHz
MFRM = 5 (1.18 s)
mA
Notes:
1 In idle mode, the module is registered to the network, USB bus is active, no voice or data call
connection is ongoing.
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4 RF Specifications
4.1 Operating Frequencies
Table 4-1 RF bands
EM560
Operating Band Tx Rx
TD-SCDMA 2100
(Band I)
2010–2025 MHz 2010–2025 MHz
TD-SCDMA 1900
(Band II)
1880–1920 MHz 1880–1920 MHz
GSM 900 880–915 MHz 925–960 MHz
GSM 1800(DCS) 1710–1785 MHz 1805–1880 MHz
4.2 Conducted Rx sensitivity and Tx power
Table 4-2 EM560 conducted Rx sensitivity
Item 3GPP Protocol Claim Test Value Unit
GSM900 (CS, 2.43%) <–102 dBm
DCS (CS, 2.43%) <–102 dBm
TD-SCDMA BAND I (0.1%) <–108 dBm
TD-SCDMA BAND II (0.1%) <–108 dBm
Table 4-3 EM560 conducted Tx power
Item 3GPP Protocol Claim Test Value Unit
GSM900 (CS) >31 dBm
GSM900 (PS) >25 dBm
DCS (CS) >28 dBm
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DCS (PS) >24 dBm
TD-SCDMA BAND I >21 dBm
TD-SCDMA BAND II >21 dBm
% = Bit Error Rate or Block Error Rate
4.3 Antenna Design Requirements
4.3.1 Recommended Index of theModule Antennas
Table 4-4 Recommended index of the TD-SCDMA antenna
Working frequency 2010MHz~2025 MHz MHz and 1880MHz~1920 MHz
Port impedance 50 Ohm
Port standing wave < 2.5
Peak gain > 0 dBi
Antenna efficiency > 60%
Polarization Linear polarization
Pattern Omnidirectional
Table 4-5 Recommended index of the WIFI antenna
Working frequency 2400MHz
Port impedance 50 Ohm
Port standing wave < 2.5
Peak gain > –3 dBi
Antenna efficiency > 30%
Polarization Linear polarization
Pattern Omnidirectional
Table 4-6 Recommended index of the isolation between themain antenna and the
auxiliary antenna
Antenna isolation < –10 dB
Because the PC has other internal antennas such as the WLAN antenna, to ensure
the proper operation of each communication system, requirements on antenna
isolation between different communication systems should be considered. Table 4-7
lists the recommended index of the antenna isolation.
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Table 4-7 Recommended index of the isolation between themodule antennas and
other PC antennas
Antenna isolation < –20 dB
4.3.2 Design Recommendations
Recommendations for Designing the Module Antennas
The design recommendations are as follows:
1. It is recommended that the module antennas are designed at the upper edge,
left edge or right edge of the PC screen. Designing the antenna at the upper
edge is better.
2. When designing the TD-SCDMA antenna and the WIFI antenna, the requirement
on the antenna isolation should be considered (the recommended value is listed
in Table 4-6).
3. You are recommended to design the antenna pattern as the horizontal polarized
omnidirectional pattern that facilitates the reception of strong signals especially
in outdoor environments.
4. Besides the module antennas, a PC has other internal antennas, such as the
WLAN antenna. Therefore, when designing the module antennas, the
requirement on the isolation between module antennas and other PC antennas
should be considered (the recommended value is listed in Table 4-7). Keep
proper distance between antennas if possible. To reduce the interference
between antennas, it is not recommended that an antenna is designed closely
next to another one.
5. Carefully design the metallic components (such as the external frame of the
metallic shell) in and near the antenna area with considering the effects on the
antenna performance (such as whether the frequency offset of the antenna
occurs and whether the antenna pattern is deformed).
Recommendations for Handling the Interference Sources
On a PC, there are various interference sources, such as the LCD, CPU, audio
circuits, and power supply. All the interference sources emit interference signals that
affect the normal operation of the module. For example, the module sensitivity can be
decreased due to interference signals. Therefore, during the design, you need to
consider how to lessen the effects of interference sources on the module. You can
take the following measures: Use an LCD with optimized performance; shield the
LCD interference signals; shield the signal cable of the PC; or design filter circuits.
4.4 Offline Mode
The offline mode can be enabled by the following methods:
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l Through hardware: The W_DISABLE pin can be used to control the RF circuit.
When the pin is driven to the high level, the RF circuit works; when the pin is
driven to the low level, the RF circuit does not work.
l Through software: The AT command of AT^RFSWITCH can be used to control
and query the status of the RF circuit.
For the offline mode, the following customizations can be realized on the firmware:
1. The RF circuit works each time the module is powered on.
2. The RF circuit does not work each time the module is powered on.
3. When the module is powered on for the first time, the RF circuit works, and then
the module can remember the users\' operations.
4. When the module is powered on for the first time, the RF circuit does not work,
and then the module can remember the users\' operations.
All the preceding customized states are set before the module is delivered and
cannot be changed by the end users.
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5 Software and Tools
Huawei can provide the firmware, PC driver, dashboard, and software. The firmware
runs on the module; the PC driver and dashboard run on the PC and communicate
with the firmware to realize all module functions. Huawei can also provide the
software for upgrading the firmware and debugging the problems.
5.1 Firmware
The firmware is software on the module. It accepts commands and data from the host
through USB. The host can send AT commands to enable the firmware to connect,
disconnect, or query.
5.1.1 Version Descriptions
In the version number, the front digits is the firmware version that can differ which
version is newer. The upper bits (except the last two bits) has boarder meaning in the
version name. If the customer has special order to our common version, the order will
be implemented in special version. The version is named by last two bits, but the
front bits are still the common version.
5.2 Drivers
A driver is a program running on the host system, which allows the host system to
interact with the Huawei wireless module. The driver communicates with the firmware
of the module by using the USB protocol.
The USB manufacturer ID for all Huawei USB devices is 0x12D1.
The USB product ID for the EM560 device is 0x1001. There are three USB interfaces
in the USB product ID.
XX.XXX.XX.XX.XX
Firmware version Customization version
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5.2.1Windows Drivers
Huawei provides windows drivers to supportWindows 2000/XP/Vista.
Huawei provides the following two ways to install the drivers:
l The drivers are packed in the dashboard, and they will be installed during the
dashboard installation.
l The drivers are provided as an installer, which can be directly installed under
Windows 2000/XP/Vista.
After the drivers are installed, when the EM560 is connected to the USB bus, it will be
detected as a USB device and start enumerating. During this process, multiple
drivers are loaded. These drivers expose a number of virtual COM ports.
In Windows OSs, you can check the enumerated devices and their configuration in
the device manager. If you switch to View by connection, the device manager
displays the main USB device and interfaces, as shown in Figure 5-1, this figure is
just a sample, different products maybe add or remove some ports.
Figure 5-1 HUAWEI USB device and interfaces
The following interfaces and ports are supported by EM560:
l HUAWEI Mobile Connect – 3G Modem: used to set up a data connection.
l HUAWEI Mobile Connect – 3G Application Interface: used to write and read